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Micron Serial NAND

作者: 來源: 發(fā)布時(shí)間:2020-06-02  瀏覽:12

關(guān)鍵字: Serial NAND “Embedded applications” has become an umbrella term for some of the most compelling devices available, including intelligent or interactive toys, books, and games; Web-enabled printers and computer peripherals; and backward-compatible WiMAX boxes. In the past, these embedded designs relied only on serial peripheral interface (SPI) NOR Flash for code shadowing, data storage, or storing BIOS and firmware. But as embedded applications continue to evolve and require more density, Serial NAND devices, with the lowest cost-per-megabit of any serial flash solution, offer the right option for them. With four times or more the density of SPI NOR, Serial NAND is a great alternative to NOR for many embedded designs. And since Serial NAND has the lowest cost-per-megabit of any serial Flash solution, it’s also a great way to lower your BOM cost.

編輯:admin  最后修改時(shí)間:2020-06-02

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    Part Density Status Width Voltage Package Pin Count Bits/Cell Op Temp
    MT29F1G01AAADDH4 1Gb Production x1 3.3V VFBGA 63-ball SLC 0C to +70C
    MT29F1G01AAADDH4-IT 1Gb Production x1 3.3V VFBGA 63-ball SLC -40C to +85C
    MT29F1G01ZACM58A3WC1 1Gb End of Life x1 3.3V Wafer n/a SLC 0C to +70C
    MT29F2G01AAAEDH4 2Gb Production x1 3.3V VFBGA 63-ball SLC 0C to +70C
    MT29F2G01AAAEDH4-IT 2Gb Production x1 3.3V VFBGA 63-ball SLC -40C to +85C
    MT29F2G01AAAEDHC 2Gb End of Life x1 3.3V VFBGA 63-ball SLC 0C to +70C
    MT29F2G01AAAEDHC-IT 2Gb End of Life x1 3.3V VFBGA 63-ball SLC -40C to +85C
    MT29F4G01AAADDHC 4Gb Production x1 3.3V VFBGA 63-ball SLC 0C to +70C
    MT29F4G01AAADDHC-IT 4Gb Production x1 3.3V VFBGA 63-ball SLC -40C to +85C